1、 Introduction
SEC-160#It is a new type of single liquid acid etching solution, which has the characteristics of simple control, low hydrochloric acid content, fast etching rate and high copper dissolution. The drug solution has excellent stability and small side corrosion. It can be applied to all acid copper chloride etching control systems (including the inner layer of multilayer board). Mainly used for:
1. Replace hydrogen peroxide or chlorate to avoid danger.
two. Replace ferric chloride to avoid environmental pollution.
3. Replace the acid etching salt, simplify the control method and improve the stability of etching.
4. Replace pure hydrochloric acid etching to improve the etching speed and quality.
In the current circuit board industry, the traditional etching method is ferric chloride etching,Hydrochloric acid etching,hydrochloric acid+Regenerant (hydrogen peroxide, etching salt, chlorate solution), ammonia+蝕刻鹽。其中氨water+蝕刻鹽及hydrochloric acid+It can be used in any ordinary way, so it can be used in any board regeneration system.
The company has been engaged in the development and production of etching solution for many years. On the basis of absorbing the experience of peers and repeated tests, the company has developed a new generation of etching solution—SEC-160#。 The etching solution has the advantages of stable composition, high copper etching rate, fast etching speed and less pollution. In particular, it contains no oxidant, single liquid type and is very easy to control. It can be used in all acidic copper chloride etching systems (including automatic systems).
Cost accounting 1two0 kg copper corrosion 1two0 kg copper corrosion
hydrochloric acid1000千克 SWE-two60#900-1000千克
Hydrogen peroxide (50%) uses 100-two00kg of water, and the electricity consumption is about 10-two0% less than that of hydrogen peroxide
The etching speed of electricity and water is 10-two0% faster than that of hydrogen peroxide
Conclusion: To sum up, sec-160# environmental friendly acidic etching solution is an ideal etching solution.
two、 Operating conditions:
Copper ion 1two0-140 g / L
Chloride ion 160-180 g / L
Temperature 40-500c
PH value 0.5-1.5
Baume degrees two4-two8
3、 Usage and solution control:
It can be added automatically or manually.
Manual: first drain 1 / 5-1 / 4 mother liquor, and then add the same amount of make-up liquid.
Automatic: adjust the specific gravity control toBetween two5-two7 o be, lower specific gravity can obtain faster etching speed. Refer to the equipment manual for the adjustment method.
When preparing the tank, add the following components into the water in sequence, and the solid materials must be completely dissolved:
form | Concentration |
Copper chloride (CuCltwo ? twoHtwoO) | 350-400g/L |
hydrochloric acid (HCl)31% | 180-two00ml/L |
SWE-two60# | two80-300ml/L |
water | Margin |
However, in the actual operation, it is not necessary to prepare the tank according to the above method, but use the existing acidic copper chloride etching waste liquid (Baume degree is not less than)two5 degrees) add sec-160#, prepared working fluidtwotwo-two4 Baume degrees, sec-160#Add no less thantwo0%即可。通常將該等蝕刻廢液稱為母液,各種酸性氯化銅的蝕刻廢液(ashydrochloric acid-雙氧water、hydrochloric acid-氯酸鹽或hydrochloric acid-催化劑型的蝕刻廢液)均可作為SEC-160#Mother liquor of acid etching solution.
4、 Maintenance:
becauseSEC-160#酸性蝕刻液中hydrochloric acid濃度較低,對雜質(zhì)的溶解力不ashydrochloric acid-雙氧water型蝕刻液強(qiáng),應(yīng)盡量避免蝕刻液受污染。需每天清洗過濾網(wǎng),同時(shí)留意噴嘴是否堵塞,蝕刻機(jī)15-30天清洗一次。
5、 Safety, storage and transportation:
本品具有腐蝕性,操作時(shí)需穿保護(hù)衣物及戴上手套。as不慎接觸皮膚及眼睛,必須用大量清water沖洗,嚴(yán)重時(shí)要送醫(yī)院治療。
It shall be packed in closed plastic containers and stored in a cool place without direct sunlight.
6、 Troubleshooting:
SEC-160#The acid etching solution is quite stable. Under normal circumstances, the etching can be carried out quickly and stably only by controlling the density of the working solution. In case of poor control, the faults and troubleshooting methods are as follows:
1. Slow etching speed
It is usually caused by low temperature or spray pressure. Under normal conditions, the copper content may be too high or too low. According to the specific situation1) Supplement sec-160#Reduce density totwo4oBe。 two) Add high concentration mother liquor or etching waste plate until the copper content is normal.
two. Precipitation of working fluid
可能是銅含量過高或hydrochloric acid含量不足。銅含量過高時(shí)還伴隨蝕刻速度變慢、溶液粘度增加等現(xiàn)象,按前款之1)處理。hydrochloric acid含量不足可根據(jù)化驗(yàn)結(jié)果補(bǔ)充hydrochloric acid。
3. Irregular brown patches appear on the board
這是hydrochloric acid含量不足所致。用稀hydrochloric acid溶液清洗,可發(fā)現(xiàn)斑塊下是未被蝕刻掉的銅。產(chǎn)生這種現(xiàn)象,蝕刻液中hydrochloric acid含量僅有3-5%, to be supplemented to 7-8%.
4. The resist is damaged
hydrochloric acid含量及溫度過高,造成線路蝕刻不整齊(鋸齒狀)。
板子在用water洗時(shí),殘留在板上的工作液出現(xiàn)白色混濁(可被water洗去)屬正?,F(xiàn)象。
7、 Cost accounting:
Sec-160# service conditions:
Temperature: 45-55 ℃
Density: two4-two6 o be
Spray pressure: two.two-two.5kg/cmtwo
Etching speed: twom / min
Copper foil thickness: H / 0
Under the above conditions, per tonSEC-160#Acid etching solution (tax included)1two00 / ton) about 1two00m of etchable copper platetwoTo produce copper corrosion waste liquid1two00Kg(以不含稅價(jià)900/噸計(jì)),其材料成本as下式:(1*1two00/1.17-1.two*900)/1two00 = -0.045元/Mtwo
If the copper etching waste liquid cannot be sold, the company can provide it on behalf of the company1: 1 exchange sec-160#Acid etchant service. The material cost is zero.
asSEC-160#If the use conditions change, the cost will also change.
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